Process Capability
| Item | Parameter | Remark |
| Layer | ≤16L | Mass Production≤12L |
| Material Type | Major CCL: FR-4,High Frequency，Aluminum，Halogen-Free |
Major Brand: SHENYI, KB, ITEQ, ISOLA,EMC,NANYA,PANSONIC,ROGERS, POLYTRONICS |
| Board Thickness | 0.3mm-4.0mm | |
| Finished Cu thickness | 0.5oz-4oz | |
| Min Hole size | 0.2mm | Finished hole size |
| Board size | Max:533*620mm | |
| Min Width&Space | 3mil/3mil | |
| Impedance control | Yes | |
| Surface finish | HAL | |
| Lead Free HAL | ||
| Immersion Gold | ||
| Immersion Tin | ||
| Immersion Silver | ||
| OSP | ||
| Technology | BGA | |
| Gold Finger | ||
| Carbon Ink | ||
| Peelable | ||
| Solder mask | White,Black,Blue,Green,Yellow,Red |
Major Brand : TAIYO,Kuangshun,Electra |